US 12,442,774 B2
Substrate inspecting apparatus and operating method thereof
Yong Jun Lee, Cheonan-si (KR)
Assigned to SEMES CO., LTD., Cheonan-si (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Dec. 8, 2023, as Appl. No. 18/534,505.
Claims priority of application No. 10-2022-0171775 (KR), filed on Dec. 9, 2022.
Prior Publication US 2024/0192144 A1, Jun. 13, 2024
Int. Cl. G01N 21/95 (2006.01); G01N 21/956 (2006.01); G02B 5/30 (2006.01); H01L 21/66 (2006.01)
CPC G01N 21/9501 (2013.01) [G01N 21/956 (2013.01); G02B 5/3058 (2013.01); H01L 22/12 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An optical-based substrate inspecting apparatus, comprising:
a light source configured to generate incident light;
an illumination optical system configured to form an optical path of the incident light;
an imaging optical system configured to form an optical path of reflected light reflected from a substrate;
a light detector configured to receive the reflected light and convert the received reflected light into an electrical signal; and
a processor configured to generate a spectral image from the electrical signal,
wherein the processor is configured to:
obtain standard reflectance distribution data according to changes in inspection parameters for a first substrate which is a reference substrate;
identify configuration values for the inspection parameters;
obtain measured reflectance distribution data for a second substrate which is another reference substrate, using the inspection parameters to which the configuration values are applied;
calculate an angle of incidence (AOI) distribution within a field of view (FOV) by comparing the standard reflectance distribution data and the measured reflectance distribution data; and
detect a distortion area where AOI distortion occurs in the FOV based on the AOI distribution.