US 12,442,739 B2
Device and method for evaluating the susceptibility of hot cracking in additive manufacturing
Sindo Kou, Madison, WI (US)
Assigned to Wisconsin Alumni Research Foundation, Madison, WI (US)
Filed by Wisconsin Alumni Research Foundation, Madison, WI (US)
Filed on Oct. 28, 2022, as Appl. No. 17/976,269.
Prior Publication US 2024/0139811 A1, May 2, 2024
Int. Cl. G01N 3/08 (2006.01); B29C 64/245 (2017.01); B29C 64/393 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B22F 10/25 (2021.01); B22F 10/28 (2021.01); B22F 12/30 (2021.01); B23K 26/342 (2014.01); B29C 64/153 (2017.01); B33Y 40/00 (2020.01)
CPC G01N 3/08 (2013.01) [B29C 64/245 (2017.08); B29C 64/393 (2017.08); B33Y 50/02 (2014.12); B22F 10/25 (2021.01); B22F 10/28 (2021.01); B22F 12/30 (2021.01); B23K 26/342 (2015.10); B29C 64/153 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12); G01N 2203/0017 (2013.01); G01N 2203/0057 (2013.01); G01N 2203/0244 (2013.01); G01N 2203/0282 (2013.01)] 25 Claims
OG exemplary drawing
 
1. A device for evaluating the susceptibility of hot cracking in an additive manufacturing process, comprising:
a deposition device configured to deposit a layer of a material on a substrate;
a base in spaced relation to the deposition device and being configured to support the substrate;
a first connection arrangement connectable to the base and adapted for interconnecting to a first end of the substrate to the base;
a second connection arrangement slidably supported on the base and being connectable to a second end of the substrate;
a drive mechanism operatively connected to one of the base and the deposition device and being configured to axially move the one of the base and the deposition device in a selected direction at a speed as the layer of material is being deposited on the substrate; and
a puller mechanism operatively connected to the second connection arrangement, the puller mechanism pulling the second connection arrangement away from the first connection arrangement.