US 12,442,693 B2
Temperature sensor assembly
Joerg Gebhardt, Mainz (DE); Patric Ackermann, Fischbachtal (DE); Subhashish Dasgupta, Bangalore (IN); Wilhelm Daake, Petershagen (DE); Karsten Schroeder, Petershagen (DE); and Guruprasad Sosale, Munich (DE)
Assigned to ABB Schweiz AG, Baden (CH)
Filed by ABB Schweiz AG, Baden (CH)
Filed on Aug. 1, 2022, as Appl. No. 17/878,143.
Claims priority of application No. 21189173 (EP), filed on Aug. 2, 2021.
Prior Publication US 2023/0030690 A1, Feb. 2, 2023
Int. Cl. G01K 1/143 (2021.01); G01K 1/02 (2021.01); G01K 1/08 (2021.01); G01K 1/16 (2006.01); G01K 3/14 (2006.01); G01K 7/42 (2006.01); G01K 13/02 (2021.01)
CPC G01K 1/143 (2013.01) [G01K 1/026 (2013.01); G01K 1/08 (2013.01); G01K 1/16 (2013.01); G01K 3/14 (2013.01); G01K 7/42 (2013.01); G01K 7/427 (2013.01); G01K 13/02 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A temperature sensor assembly configured to be coupled thermally to a vessel wall for determining a temperature of a surface of the vessel wall, the assembly comprising:
a first single-branched thermal conduction path defined between the surface of the vessel wall and an environment of the temperature sensor assembly, wherein the first single-branched thermal conduction path includes a temperature measurement sensor that is configured to be thermally coupled to a first site of the surface of the vessel wall resulting in a first thermal resistance; and
a second single-branched thermal conduction path defined between a second site of the surface of the vessel wall and an environment of the temperature sensor assembly, wherein the second single-branched thermal conduction path includes a reference temperature sensor that is configured to be thermally coupled to the surface of the vessel wall resulting in a second thermal resistance,
wherein the first single-branched thermal conduction path or the second single-branched thermal conduction path are insulated by an insulating material to reduce a thermal coupling between the first single-branched thermal conduction path and the second single-branched thermal conduction path.