| CPC G01K 1/14 (2013.01) [H01M 10/486 (2013.01)] | 18 Claims |

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1. A temperature monitoring apparatus, comprising an isolation plate, an aluminum bar for connection, a flexible printed circuit board and a temperature measurement assembly;
wherein a first mounting frame and a second mounting frame are on the isolation plate, the aluminum bar for connection is embedded into the first mounting frame, the flexible printed circuit board is laid on the surface of the isolation plate in a way that the flexible printed circuit board partially overlaps with the second mounting frame, the temperature measurement assembly is on the flexible printed circuit board and at an overlapping part of the flexible printed circuit board and the second mounting frame, a heat conducting pad of the temperature measurement assembly extends out the second mounting frame, and the temperature sensor of the temperature measurement assembly is close to the heat conducting pad;
wherein when the aluminum bar for connection is connected to a device to be monitored through a part of the aluminum bar for connection exposed from the first mounting frame, the heat conducting pad is attached to the device to be monitored.
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