US 12,442,687 B2
Optical sensor transparent cover with array contact grid
Brian Anthony Vaartstra, Nampa, ID (US); and Larry Duane Kinsman, Redding, CA (US)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US)
Filed on Nov. 17, 2022, as Appl. No. 18/056,524.
Prior Publication US 2024/0167873 A1, May 23, 2024
Int. Cl. G01J 3/28 (2006.01); G01D 5/24 (2006.01)
CPC G01J 3/2803 (2013.01) [G01D 5/24 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A package comprising:
an optical sensor die having a surface including an optically active surface area (OASA) and an edge surface portion lying outside a perimeter of the OASA;
a support grid structure disposed on the surface of the optical sensor die, the support grid structure including at least one pillar disposed within the OASA and an edge block disposed on the edge surface portion lying outside the perimeter of the OASA; and
an optically transparent cover attached to the support grid structure, the edge block of the support grid structure supporting the optically transparent cover at a first height above the optical sensor die while maintaining an air gap between the optically transparent cover and the OASA, the at least one pillar having a second height equal to or less than the first height.