US 12,442,600 B2
Thermal module assembling structure
Sheng-Huang Lin, New Taipei (TW); and Yuan-Yi Lin, New Taipel (TW)
Assigned to ASIA VITAL COMPONENTS CO., LTD., New Taipei (TW)
Filed by ASIA VITAL COMPONENTS CO., LTD., New Taipei (TW)
Filed on Dec. 12, 2022, as Appl. No. 18/064,287.
Claims priority of application No. 111103924 (TW), filed on Jan. 28, 2022.
Prior Publication US 2023/0243595 A1, Aug. 3, 2023
Int. Cl. F28D 15/02 (2006.01); F28F 9/26 (2006.01); F28F 21/08 (2006.01)
CPC F28D 15/0275 (2013.01) [F28F 9/268 (2013.01); F28F 21/085 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A thermal module assembling structure comprising:
an aluminum base seat having a heat absorption side, a heat conduction side and a connection section, the connection section being disposed on the heat absorption side, the connection section being correspondingly connected with at least one copper heat pipe, a copper embedding layer being disposed on a portion of the connection section, the copper embedding layer being a copper sheet or copper foil, the portion of the connection section being in contact and connection with the copper heat pipe, whereby the aluminum base seat can be directly welded with the copper heat pipe, wherein the copper embedding layer has an embedding face and a contact face respectively positioned on two opposite faces of the copper embedding layer, the embedding face being deeply engaged and inlaid in the connection section so as to make the embedding face form an uneven surface, wherein the contact face is capable of being directly used for welding.