US 12,442,102 B2
Apparatus for plating and method of plating
Naoto Takahashi, Tokyo (JP); and Naoki Shimomura, Tokyo (JP)
Assigned to EBARA CORPORATION, Tokyo (JP)
Appl. No. 17/923,570
Filed by EBARA CORPORATION, Tokyo (JP)
PCT Filed Jun. 18, 2021, PCT No. PCT/JP2021/023193
§ 371(c)(1), (2) Date Nov. 4, 2022,
PCT Pub. No. WO2022/264402, PCT Pub. Date Dec. 22, 2022.
Prior Publication US 2025/0075362 A1, Mar. 6, 2025
Int. Cl. C25D 17/00 (2006.01); C25D 5/02 (2006.01); C25D 7/12 (2006.01); C25D 17/12 (2006.01)
CPC C25D 17/001 (2013.01) [C25D 5/022 (2013.01); C25D 7/12 (2013.01); C25D 17/002 (2013.01); C25D 17/008 (2013.01); C25D 17/12 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An apparatus for plating a substrate, comprising:
an anode placed to be opposed to the substrate; and
an intermediate mask placed between the substrate and the anode to be arranged on a substrate side, provided with a first center opening that causes an electric field from the anode toward the substrate to pass through, and further provided with an auxiliary anode that is placed in an internal space of the intermediate mask to be arranged around the first center opening, wherein
the auxiliary anode has an area that is not greater than ⅕ of an area of the anode, wherein the intermediate mask comprises:
a mask main body provided with a second center opening and further provided with the internal space that is arranged around the second center opening and that is open on a substrate side thereof; and
a shielding plate placed to cover the internal space of the mask main body, provided with a third center opening that is smaller than the second center opening and that defines the first center opening, and further provided with a first opening that overlaps with at least a partial area of the auxiliary anode.