US 12,442,101 B2
Electroplating method for enhancing the performance of rolled-up passive components
Xiuling Li, Austin, TX (US); Apratim Khandelwal, Champaign, IL (US); and Zhendong Yang, Austin, TX (US)
Assigned to THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS, Urbana, IL (US)
Filed by The Board of Trustees of the University of Illinois, Urbana, IL (US)
Filed on Oct. 18, 2021, as Appl. No. 17/503,603.
Claims priority of provisional application 63/093,363, filed on Oct. 19, 2020.
Prior Publication US 2022/0119976 A1, Apr. 21, 2022
Int. Cl. H01F 7/06 (2006.01); C25D 5/10 (2006.01); C25D 7/06 (2006.01); H01F 17/00 (2006.01); H01F 41/061 (2016.01)
CPC C25D 7/0657 (2013.01) [C25D 5/10 (2013.01); H01F 17/0013 (2013.01); H01F 41/061 (2016.01)] 20 Claims
OG exemplary drawing
 
1. An electroplating method for enhancing a performance of rolled-up passive components, the method comprising:
providing an array of the rolled-up passive components on a substrate, each rolled-up passive component comprising a multilayer strip in a rolled configuration including multiple turns spaced apart by gaps, a core of each rolled-up passive component being defined by a first of the multiple turns, the multilayer strip comprising a conductive pattern layer on a strain-relieved layer; and
electroplating a layer comprising a functional material onto the conductive pattern layer of each rolled-up passive component, thereby at least partly filling the gaps and/or the core with the functional material.