US 12,442,098 B2
Methods of electrochemical deposition
Gary William Leach, Coquitlam (CA); Sasan Vosoogh-Grayli, North Vancouver (CA); and Finlay Charles Henry Macnab, Vancouver (CA)
Filed by Gary William Leach, Coquitlam (CA)
Filed on Jan. 28, 2019, as Appl. No. 16/260,091.
Application 16/260,091 is a continuation in part of application No. PCT/CA2017/050914, filed on Jul. 28, 2017.
Claims priority of provisional application 62/368,292, filed on Jul. 29, 2016.
Prior Publication US 2019/0256995 A1, Aug. 22, 2019
Int. Cl. C23C 18/31 (2006.01); C23C 18/08 (2006.01); C23C 18/14 (2006.01); C23C 18/42 (2006.01); C23C 18/54 (2006.01); C25D 3/02 (2006.01); C25D 3/56 (2006.01)
CPC C25D 3/02 (2013.01) [C23C 18/08 (2013.01); C23C 18/143 (2019.05); C23C 18/31 (2013.01); C23C 18/42 (2013.01); C23C 18/54 (2013.01); C25D 3/56 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of electrochemical deposition of a metallic material onto a substrate, the method comprising:
providing an alkaline solution of hydroxide ions;
immersing a metallic material precursor and the substrate into the alkaline solution to form an electrochemical bath;
controlling a molar ratio of a concentration of hydroxide ions to a concentration of the metallic material precursor in the electrochemical bath to selectively adjust electrochemical deposition of the metallic material; and
electrochemically depositing a textured layer of the metallic material onto the substrate, the electrochemical deposition of the metallic material comprising an electroless deposition wherein all electrons for the electroless deposition come from the hydroxide ions, the hydroxide ions acting as the reducing agent for the electroless deposition.