US 12,442,097 B2
Electroforming system and method
Ashwini Sameer Wadhavkar, Bengaluru (IN); Dattu Guru Venkata Jonnalagadda, Bengaluru (IN); Rajapriyan Rajendran, Bengaluru (IN); Gordon C. Tajiri, Waynesville, OH (US); and Udaya Bhaskar Pamidimarri, Bengaluru (IN)
Assigned to Unison Industries, LLC, Jacksonville, FL (US)
Filed by Unison Industries, LLC, Jacksonville, FL (US)
Filed on Oct. 31, 2023, as Appl. No. 18/498,245.
Application 18/498,245 is a continuation of application No. 17/558,160, filed on Dec. 21, 2021, granted, now 11,898,260.
Claims priority of application No. 202111038059 (IN), filed on Aug. 23, 2021.
Prior Publication US 2024/0060200 A1, Feb. 22, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. C25D 1/10 (2006.01); C25D 17/06 (2006.01); C25D 17/12 (2006.01)
CPC C25D 1/10 (2013.01) [C25D 17/06 (2013.01); C25D 17/12 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A system for electroforming a component, comprising:
a first housing forming a dissolution reservoir, the dissolution reservoir containing an electrolytic fluid;
a first anode coupled to or at least partially located within the first housing; and
a second housing located exterior of the first housing, the second housing adapted to receive a component, the second housing comprising:
a frame having an opening;
a mesh spaced from the component and coupled to the frame to define a base structure, wherein the mesh spans the opening; and
an electrically insulating sheet covering at least a portion of the base structure and wherein the electrically insulating sheet defines a fluid passage, the component to be located in the fluid passage.