US 12,442,077 B2
Substrate processing apparatus
Tae Dong Kim, Osan-si Gyeonggi-do (KR); Jung Hwan Lee, Osan-si Gyeonggi-do (KR); Cheong Hwan Jeong, Anseong-si Gyeonggi-do (KR); Sung Ho Roh, Yongin-si Gyeonggi-do (KR); and Young Jun Kim, Pyeongtaek-si Gyeonggi-do (KR)
Assigned to WONIK IPS CO., LTD., Pyeongtaek-si (KR)
Filed by WONIK IPS CO., LTD., Pyeongtaek-si Gyeonggi-do (KR)
Filed on Sep. 1, 2022, as Appl. No. 17/901,521.
Claims priority of application No. 10-2021-0117029 (KR), filed on Sep. 2, 2021.
Prior Publication US 2023/0073851 A1, Mar. 9, 2023
Int. Cl. C23C 16/455 (2006.01); C23C 16/44 (2006.01); C23C 16/458 (2006.01)
CPC C23C 16/45557 (2013.01) [C23C 16/4409 (2013.01); C23C 16/4412 (2013.01); C23C 16/45517 (2013.01); C23C 16/45563 (2013.01); C23C 16/4585 (2013.01); C23C 16/4586 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a process chamber comprising a chamber body which has an opened upper portion and in which an installation groove is defined at a central side of a bottom surface thereof, and a gate configured to load/unload a substrate is disposed at one side thereof, and a top lid coupled to the upper portion of the chamber body to define an inner space;
a substrate support installed to be inserted into the installation groove of the chamber body and having a top surface on which the substrate is seated;
an inner lid part which is installed to be vertically movable in the inner space and of which a portion is in close contact with the bottom surface adjacent to the installation groove through descending to define a sealed processing space in which the substrate support is disposed;
a gas supply part installed to communicate with the processing space and configured to supply a process gas to the processing space;
an inner lid driving part installed to pass through the top lid to drive the vertical movement of the inner lid part; and
a filling member installed between the substrate support and an inner surface of the installation groove to occupy at least a portion of a space between the substrate support and the inner surface of the installation groove.