US 12,442,076 B2
Method and system for depositing noble metal-containing layer
Timo Hatanpää, Espoo (FI); Anton Vihervaara, Helsinki (FI); and Mikko Ritala, Espoo (FI)
Assigned to ASM IP Holding B.V., Almere (NL)
Filed by ASM IP Holding B.V., Almere (NL)
Filed on Feb. 12, 2024, as Appl. No. 18/438,612.
Claims priority of provisional application 63/445,321, filed on Feb. 14, 2023.
Prior Publication US 2024/0279805 A1, Aug. 22, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. C23C 16/455 (2006.01); C23C 16/08 (2006.01); C23C 16/44 (2006.01)
CPC C23C 16/45553 (2013.01) [C23C 16/08 (2013.01); C23C 16/4408 (2013.01)] 26 Claims
OG exemplary drawing
 
1. A method of depositing noble metal-containing material on a substrate by a cyclic deposition process, the method comprising:
providing a substrate in a reaction chamber;
providing a noble metal precursor into the reaction chamber in a vapor phase; and
providing a second precursor into the reaction chamber in a vapor phase to form noble metal-containing material on the substrate; wherein the noble metal precursor comprises a noble metal halide compound comprising an organic phosphine adduct ligand.