US 12,442,074 B2
System and method for controlling foreline pressure
Ryan T. Downey, San Jose, CA (US); James L'Heureux, Santa Clara, CA (US); and Rony David Mathew, Bengaluru (IN)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Aug. 25, 2022, as Appl. No. 17/896,025.
Prior Publication US 2024/0068093 A1, Feb. 29, 2024
Int. Cl. H01J 37/32 (2006.01); C23C 16/44 (2006.01)
CPC C23C 16/4412 (2013.01) [H01J 37/3244 (2013.01); H01J 37/32834 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A semiconductor processing system, comprising:
a controller configured to:
determine a first foreline pressure in a foreline downstream of a first pump coupled to an exhaust port of a first processing chamber at a first time;
compare the determined first foreline pressure to a first set point; and
provide instructions to a first pressure control system interfaced with the foreline downstream of the first pump based on the comparison between the determined first foreline pressure and the first set point to adjust the first foreline pressure.