| CPC C23C 14/24 (2013.01) [C23C 14/042 (2013.01); H10K 71/164 (2023.02)] | 2 Claims |

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1. A thin film deposition apparatus for forming a thin film on a substrate, the apparatus comprising:
a deposition source that discharges a deposition material;
a deposition source nozzle unit disposed at a side of the deposition source and including a plurality of deposition source nozzles arranged in a first direction;
a patterning slit sheet disposed opposite to the deposition source nozzle unit and including a plurality of patterning slits arranged in a row in a second direction that is perpendicular to the first direction;
a frame in which the patterning slit sheet is disposed; and
a connection member which connects the deposition source, the deposition source nozzle unit, and the frame, the connection member extending at an oblique angle from a region of the deposition source nozzle unit that is spaced apart from the plurality of deposition source nozzles in the second direction to a region of the patterning slit sheet that is spaced apart from the plurality of patterning slits in the second direction,
wherein a deposition is performed while one of the substrate and the thin film deposition apparatus moves relative to the other one of the substrate and the thin film deposition apparatus in the first direction,
wherein the plurality of deposition source nozzles protrude from an upper surface of the deposition source nozzle unit toward the patterning slit sheet,
wherein the connecting member is connected to an edge of the deposition source nozzle unit and an edge of the frame, and
wherein each of the patterning slits is elongated in the first direction so as to overlap the plurality of deposition source nozzles.
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