| CPC C09K 5/14 (2013.01) [C08G 77/08 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); C08J 5/18 (2013.01); C08K 7/18 (2013.01); C08J 2383/05 (2013.01); C08J 2383/07 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01)] | 10 Claims |

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1. A thermally-conductive silicone gel composition comprising:
A a linear organopolysiloxane having one vinyl group at each terminal end of a molecular chain and a kinematic viscosity of 1 to 600 mm2/s;
B a linear organopolysiloxane having three or more Si—H groups in one molecule and an Si—H group content of 0.05 to 2 mol/kg, in an amount such that a ratio of the number of Si—H groups in B component to the number of vinyl groups in A component is 0.3 to 0.4;
C a platinum group metal-based catalyst in a catalytic amount; and
D a thermally-conductive filler in an amount of 300 to 1000 parts by mass when a total amount of A and B is taken as 100 parts by mass, including
D1 50 to 400 parts by mass of at least one type of spherical alumina with an average particle size of 1 to 5 μm, a part or a whole of the alumina being surface-treated with RaSi(OR′)4-a, where R represents an unsubstituted or substituted organic group having 8 to 12 carbon atoms, R′ represents an alkyl group having 1 to 4 carbon atoms, and a is 1, and
D2 100 to 950 parts by mass of at least one type of spherical alumina with an average particle size of 10 to 100 μm.
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