US 12,441,917 B2
Electroconductive adhesive
Ryo Katou, Osaka (JP); Masatoshi Okuda, Osaka (JP); Junichirou Minami, Osaka (JP); and Takamichi Mori, Osaka (JP)
Assigned to OSAKA SODA CO., LTD., Osaka (JP)
Appl. No. 18/040,624
Filed by OSAKA SODA CO., LTD., Osaka (JP)
PCT Filed Sep. 3, 2021, PCT No. PCT/JP2021/032519
§ 371(c)(1), (2) Date Feb. 3, 2023,
PCT Pub. No. WO2022/070778, PCT Pub. Date Apr. 7, 2022.
Claims priority of application No. 2020-164209 (JP), filed on Sep. 30, 2020.
Prior Publication US 2023/0303895 A1, Sep. 28, 2023
Int. Cl. C09J 9/02 (2006.01); C08K 3/08 (2006.01); C09J 11/04 (2006.01)
CPC C09J 9/02 (2013.01) [C08K 3/08 (2013.01); C09J 11/04 (2013.01); C08K 2003/0806 (2013.01); C08K 2201/011 (2013.01)] 2 Claims
OG exemplary drawing
 
1. A method for producing a sintered body, the method comprising:
(a) removing moisture from an electroconductive adhesive containing silver particles and a solvent, wherein a moisture content of the solvent in the electroconductive adhesive is 1300 ppm or less; and
(b) sintering the electroconductive adhesive with the solvent having a moisture content of 1300 ppm or less at a temperature of 150° C. or higher and 250° C. or lower.