US 12,441,896 B2
Conductive coating material and circuit former
Katsutomo Wakabayashi, Kuki (JP); Akinori Naruse, Kuki (JP); and Yuka Azakami, Kuki (JP)
Assigned to Fujikura Kasei Co., Ltd., Tokyo (JP)
Appl. No. 18/857,654
Filed by Fujikura Kasei Co., Ltd., Tokyo (JP)
PCT Filed Apr. 21, 2023, PCT No. PCT/JP2023/015879
§ 371(c)(1), (2) Date Oct. 17, 2024,
PCT Pub. No. WO2023/210522, PCT Pub. Date Nov. 2, 2023.
Claims priority of application No. 2022-073168 (JP), filed on Apr. 27, 2022.
Prior Publication US 2025/0257227 A1, Aug. 14, 2025
Int. Cl. H01B 1/22 (2006.01); C08K 3/08 (2006.01); C08K 7/18 (2006.01); C09D 5/24 (2006.01); C09D 7/40 (2018.01); C09D 7/61 (2018.01); C09D 183/04 (2006.01)
CPC C09D 5/24 (2013.01) [C08K 3/08 (2013.01); C08K 7/18 (2013.01); C09D 7/61 (2018.01); C09D 7/69 (2018.01); C09D 7/70 (2018.01); C09D 183/04 (2013.01); H01B 1/22 (2013.01); C08K 2003/0806 (2013.01); C08K 2201/001 (2013.01)] 2 Claims
OG exemplary drawing
 
1. A conductive coating material, comprising:
a silicone resin (A); and
a conductive powder (B),
wherein a mass ratio (A/B) of the silicone resin (A) to the conductive powder (B) is 10/90 to 35/65,
the conductive powder (B) includes a flake-shaped conductive powder (B1) having an average particle size of 1 to 7 μm and an amorphous conductive powder (B2) having an average particle size of 1 to 6 μm,
a mass ratio (B1/B2) of the conductive powder (B1) to the conductive powder (B2) is 40/60 to 90/10, and Expression (1) below is satisfied,
100≤X1+X2≤260  (1),
X1=(the average particle size of the conductive powder (B1)/a tap density of the conductive powder (B1))×(a content of the conductive powder (B1) with respect to a total mass of the conductive powder (B)),
X2=(the average particle size of the conductive powder (B2)/a tap density of the conductive powder (B2))×(a content of the conductive powder (B2) with respect to the total mass of the conductive powder (B)).