	US 12,441,881 B2
	Thermal interface materials
Chunyong Wu, Plymouth, MN (US); John Timmerman, Minneapolis, MN (US); Reid Chesterfield, Eden Prairie, MN (US); and Radesh Jewram, Lakeville, MN (US)
Assigned to Henkel AG & Co. KGaA, Duesseldorf (DE)
Filed by Henkel AG & Co. KGaA, Duesseldorf (DE)
Filed on Aug. 27, 2021, as Appl. No. 17/446,211.
Application 17/446,211 is a continuation of application No. PCT/US2020/019888, filed on Feb. 26, 2020.
Claims priority of provisional application 62/811,074, filed on Feb. 27, 2019.
Prior Publication US 2021/0388203 A1, Dec. 16, 2021
Int. Cl. C08L 71/00 (2006.01); C08G 65/336 (2006.01); C08K 3/22 (2006.01); C08K 3/36 (2006.01); C08K 5/00 (2006.01); C08K 5/57 (2006.01); H01M 10/659 (2014.01)

CPC C08L 71/00 (2013.01) [C08G 65/336 (2013.01); C08K 3/22 (2013.01); C08K 3/36 (2013.01); C08K 5/0016 (2013.01); C08K 5/005 (2013.01); C08K 5/57 (2013.01); H01M 10/659 (2015.04); C08K 2003/2227 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01)]

15 Claims

1. A thermally conductive curable composition comprising a first part and a second part,

wherein the first part comprises a catalyst, a ceramic filler mixture, a low volatile organic liquid, and water,

wherein the second part comprises a silane modified polyether, a low volatile organic liquid, and a ceramic filler mixture,

wherein the low volatile organic liquid has a viscosity of less than 100 cPs, and is present in the composition in an amount greater than about 50 wt. % based on the total weight of the silane modified polyether, and wherein the silane modified polyether is present in an amount of between 1.7 wt. % and 6.5 wt. % based on the total weight of the second part, and wherein the first part and the second part are present in the curable composition in a ratio of about 1:1.