| CPC C08F 220/56 (2013.01) [A61K 6/887 (2020.01); B29C 64/135 (2017.08); B29C 64/314 (2017.08); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); C08F 2/48 (2013.01); C08F 220/18 (2013.01)] | 18 Claims |
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1. A resin composition, comprising:
an α,β-unsaturated double bond group-containing compound (A) having a ring structure (a) containing a nitrogen atom;
a (meth)acrylic acid ester compound (B) having a boiling point of 280° C. or more at normal pressure, having a carbocyclic group, and having no nitrogen-containing heterocyclic group;
a urethanized (meth)acrylic compound (D);
a photopolymerization initiator (C);
optionally, a polyfunctional polymerizable monomer (E) having a molecular weight of 500 or less and not comprised in the α,β-unsaturated double bond group-containing compound (A) and the (meth)acrylic acid ester compound (B), and
optionally, an other compound different from the α,β-unsaturated double bond group-containing compound (A), the (meth)acrylic acid ester compound (B), the urethanized (meth)acrylic compound (D) and the optional polyfunctional polymerizable monomer (E) wherein
a weight-average molecular weight Mw of the urethanized (meth)acrylic compound (D) is from 2,000 to 5,000,
a content of the urethanized (meth)acrylic compound (D) is 1 to 98 mass % relative to the total amount of the α, β-unsaturated double bond group-containing compound (A), the (meth)acrylic acid ester compound (B) and the urethanized (meth)acrylic compound (D),
if present, a content of the polyfunctional polymerizable monomer (E) having a molecular weight of 500 or less is 20 mass % or less relative to a total amount of polymerizable compounds comprised in the resin composition, and
if present, a content of the polymerizable compound different from the α,β-unsaturated double bond group-containing compound (A), the (meth)acrylic acid ester compound (B), the urethanized (meth)acrylic compound (D) and the optional polyfunctional polymerizable monomer (E) is less than 10.0 mass %, relative to the total amount of the polymerizable compounds comprised in the resin composition.
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