US 12,441,822 B2
Polymer, semiconductor composition comprising polymer, and method for manufacturing film using semiconductor composition
Hiroshi Hitokawa, Kakegawa (JP); Tomohide Katayama, Kakegawa (JP); Tomotsugu Yano, Kakegawa (JP); Rui Zhang, Kakegawa (JP); Aritaka Hishida, Kakegawa (JP); Masato Suzuki, Kakegawa (JP); Rikio Kozaki, Kakegawa (JP); and Toshiya Okamura, Kakegawa (JP)
Assigned to Merck Patent GmbH, Darmstadt (DE)
Appl. No. 17/431,974
Filed by Merck Patent GmbH, Darmstadt (DE)
PCT Filed Feb. 17, 2020, PCT No. PCT/EP2020/054001
§ 371(c)(1), (2) Date Aug. 18, 2021,
PCT Pub. No. WO2020/169493, PCT Pub. Date Aug. 27, 2020.
Claims priority of application No. 2019-027296 (JP), filed on Feb. 19, 2019.
Prior Publication US 2022/0119568 A1, Apr. 21, 2022
Int. Cl. G03F 7/039 (2006.01); C08F 220/28 (2006.01); C08F 220/30 (2006.01); C08F 220/34 (2006.01); G03F 7/004 (2006.01); G03F 7/038 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); H01L 21/027 (2006.01); H01L 21/308 (2006.01)
CPC C08F 220/346 (2020.02) [C08F 220/281 (2020.02); C08F 220/301 (2020.02); G03F 7/0045 (2013.01); G03F 7/0382 (2013.01); G03F 7/0392 (2013.01); G03F 7/2006 (2013.01); G03F 7/32 (2013.01); H01L 21/0276 (2013.01); H01L 21/3081 (2013.01); H01L 21/3086 (2013.01)] 15 Claims
 
1. A method for manufacturing a resist film comprising:
(1) applying a resist underlayer composition above a substrate;
(2) heating said resist underlayer composition to form a resist underlayer film;
(3) applying a resist composition above the resist underlayer film; and
(4) heating said resist composition to form a resist film,
wherein the resist underlayer composition comprises a polymer (A) and a solvent (B);
where polymer (A) comprises at least one structural unit selected from the group consisting of the following Units (a), (b), (c) and (d):
Unit (a) represented by the formula (a):

OG Complex Work Unit Chemistry
wherein,
Ra1 and Ra2 are each independently H, C1-5 alkyl, C1-5 alkoxy or —COOH,
La is a single bond, C1-5 alkylene, —O— or C1-5 alkoxylene,
ma is 1,
Xa1 is H or a C1-5 hydrocarbon group (one or more of —CH2— in the C1-5 hydrocarbon group can be each independently replaced with —NH—, —C(═O)— and/or —O— and one or more of —CH3 in the C1-5 hydrocarbon group can be each independently replaced with —NH2 and/or —COOH,
Ya is N or O, where when Ya is N, pa is an integer of 1 or 2, and when Ya is 0, pa is 1,
Xa2 is H or a C1-5 hydrocarbon group (one or more of —CH2— in the C1-5 hydrocarbon group can be each independently replaced with —NH—, —C(═O)— and/or —O— and one or more of —CH3 in the C1-5 hydrocarbon group can be each independently replaced with —NH2 and/or —COOH), and when pa is 2, two Xa2 can be identical or different,
where, Xa1 and Xa2 can be bonded and/or two Xa2 can be bonded when pa is 2, to form a saturated or unsaturated ring;
Unit (b) selected from the group consisting of:

OG Complex Work Unit Chemistry
Unit (c) represented by the formula (c):

OG Complex Work Unit Chemistry
wherein,
Rc1 and Rc2 are each independently H, C1-5 alkyl, C1-5 alkoxy or —COOH,
mc is 1,
Lc is a single bond, C1-5 alkylene, —O— or C1-5 alkoxylene,
Vc is a fused aromatic hydrocarbon or a fused heterocyclic ring, and Vc has 3 to 6 rings fused,
pc is 0 to 5,
Rc3 is C1-5 alkyl, C1-5 alkoxy or —COOH, and when pc>1, each Rc3 can be identical or different; and
Unit (d) represented by the formula (d):

OG Complex Work Unit Chemistry
wherein,
Rd1 and Rd2 are each independently H, C1-5 alkyl, C1-5 alkoxy or —COOH,
md is 1,
Ld is a single bond, C1-5 alkylene wherein one or more of —CH2— in the C1-5 alkylene can be replaced with —NH—, —C(═O)— and/or —O— and one or more of —CH3 in the C1-5 alkylene can be replaced with —OH, —NH2 and/or —COOH, —O— or C1-5 alkoxylene, wherein, na, nb, nc and nd, which are the molar numbers of repetition respectively of Units (a), (b), (c) and (d);
wherein the polymer (A) satisfies the following formulae:
5%≤na/(na+nb+nc+nd)≤50%,
30%≤nb/(na+nb+nc+nd)≤80%, and
5%≤nc/(na+nb+nc+nd)≤40%
wherein the total molar number (ntotal) of all repeating units contained in the polymer (A) satisfies the following formula:
80%≤(na+nb+nc+nd)/ntotal≤100%.