US 12,441,712 B2
Material for forming organic film, patterning process, and compound
Daisuke Kori, Joetsu (JP); Naoki Kobayashi, Shiojiri (JP); and Yasuyuki Yamamoto, Joetsu (JP)
Assigned to SHIN-ETSU CHEMICAL CO., LTD., Tokyo (JP)
Filed by SHIN-ETSU CHEMICAL CO., LTD., Tokyo (JP)
Filed on Oct. 4, 2022, as Appl. No. 17/960,015.
Claims priority of application No. 2021-166208 (JP), filed on Oct. 8, 2021.
Prior Publication US 2023/0121798 A1, Apr. 20, 2023
Int. Cl. C07D 403/02 (2006.01); C07D 209/40 (2006.01); C07D 403/06 (2006.01); C07D 403/10 (2006.01); G03F 7/039 (2006.01); H01L 21/027 (2006.01)
CPC C07D 403/02 (2013.01) [C07D 209/40 (2013.01); C07D 403/06 (2013.01); C07D 403/10 (2013.01); G03F 7/039 (2013.01); H01L 21/0274 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A material for forming an organic film, comprising: a compound shown by the following general formula (1); and an organic solvent,

OG Complex Work Unit Chemistry
wherein R1 represents one of the following formulae (2), R2 represents a nitro group, a halogen atom, a hydroxy group, an alkyloxy group having 1 to 4 carbon atoms, an alkynyloxy group having 2 to 4 carbon atoms, an alkenyloxy group having 2 to 4 carbon atoms, a linear, branched, or cyclic alkyl group having 1 to 6 carbon atoms, a trifluoromethyl group, or a trifluoromethyloxy group, “n” represents 0 or 1, “m” represents an integer of 1 to 3, “p” represents 0 or 1, “l” represents an integer of 0 to 2, and W represents a divalent organic group having 2 to 40 carbon atoms

OG Complex Work Unit Chemistry