US 12,441,606 B2
MEMS device including coil structure with corrugated polymer film
Jung-Hao Chang, Taoyuan (TW); and Weng-Yi Chen, Hsinchu County (TW)
Assigned to UNITED MICROELECTRONICS CORP., Hsinchu (TW)
Filed by UNITED MICROELECTRONICS CORP., Hsinchu (TW)
Filed on Dec. 6, 2022, as Appl. No. 18/075,882.
Claims priority of application No. 111143258 (TW), filed on Nov. 11, 2022.
Prior Publication US 2024/0158225 A1, May 16, 2024
Int. Cl. B81B 7/02 (2006.01); B81C 1/00 (2006.01)
CPC B81C 1/00476 (2013.01) [B81B 7/02 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/0315 (2013.01); B81B 2203/033 (2013.01); B81B 2203/0353 (2013.01); B81B 2207/01 (2013.01); B81C 2201/0108 (2013.01); B81C 2201/0132 (2013.01); B81C 2201/0133 (2013.01); B81C 2201/014 (2013.01); B81C 2201/0176 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A micro electro mechanical system (MEMS) device, comprising:
a substrate;
a polymer film on the substrate and having a lower surface facing toward the substrate, wherein the polymer film comprises a corrugation pattern on the lower surface of the polymer film;
a cavity passing through the substrate, wherein a portion of the polymer film is exposed in the cavity;
coil structures on the substrate and in the polymer film;
a dielectric layer between the substrate and the polymer film, wherein the cavity passes through the dielectric layer; and
an oxide layer between the dielectric layer and the substrate.