US 12,441,576 B2
Thermal conduction sheet holder and method of manufacturing heat dissipating device
Mika Kobune, Tokyo (JP); Michiaki Yajima, Tokyo (JP); and Keita Suga, Tokyo (JP)
Assigned to RESONAC CORPORATION, Tokyo (JP)
Appl. No. 18/031,623
Filed by RESONAC CORPORATION, Tokyo (JP)
PCT Filed Oct. 14, 2021, PCT No. PCT/JP2021/038132
§ 371(c)(1), (2) Date Apr. 13, 2023,
PCT Pub. No. WO2022/080471, PCT Pub. Date Apr. 21, 2022.
Claims priority of application No. PCT/JP2020/039140 (WO), filed on Oct. 16, 2020.
Prior Publication US 2024/0017955 A1, Jan. 18, 2024
Int. Cl. H01L 23/373 (2006.01); B23P 15/26 (2006.01); B32B 7/06 (2019.01); B65H 37/00 (2006.01); H01L 23/00 (2006.01)
CPC B65H 37/002 (2013.01) [B23P 15/26 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/74 (2013.01); H01L 24/83 (2013.01); H01L 23/3733 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29291 (2013.01); H01L 2224/29324 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29386 (2013.01); H01L 2224/29393 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/743 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83201 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/0503 (2013.01); H01L 2924/05032 (2013.01); H01L 2924/0532 (2013.01); H01L 2924/05432 (2013.01); H01L 2924/0615 (2013.01); H01L 2924/0635 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A thermal conduction sheet holder, comprising, in the following order:
an elongated carrier film;
a plurality of release layers disposed along a longitudinal direction of the carrier film;
a plurality of thermal conduction sheets;
an elongated cover film covering the plurality of thermal conduction sheets, wherein:
a shortest distance between adjacent thermal conduction sheets is 2 mm or more,
the plurality of thermal conduction sheets are disposed at intervals in the longitudinal direction of the carrier film and the cover film, and the plurality of thermal conduction sheets are peelable from the cover film and the carrier film,
one or more of the thermal conduction sheets are disposed on each of the plurality of release layers, and
the plurality of thermal conduction sheets are peelable from the carrier film via the plurality of release layers.