US 12,441,531 B2
Method for packing and unpacking flat substrates
Alexander Glacki, Hannover (DE); Andreas Brunotte, Grünenplan (DE); Rainer Buchhorn, Eschershausen (DE); Ernst-Friedrich Düsing, Alfeld (DE); Lutz Gäckle, Göttingen (DE); Michael Kania, Duingen (DE); Klaus-Peter Kurek, Mainz (DE); Michael Maedje, Grünenplan (DE); and Anke Weems, Grünenplan (DE)
Assigned to SCHOTT AG, Mainz (DE)
Filed by SCHOTT AG, Mainz (DE)
Filed on May 12, 2023, as Appl. No. 18/316,284.
Application 18/316,284 is a continuation of application No. PCT/EP2021/080590, filed on Nov. 4, 2021.
Claims priority of application No. 10 2020 130 292.4 (DE), filed on Nov. 17, 2020.
Prior Publication US 2023/0303303 A1, Sep. 28, 2023
Int. Cl. B65D 81/05 (2006.01); B65D 85/48 (2006.01)
CPC B65D 81/05 (2013.01) [B65D 85/48 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package of flat glass substrates, comprising:
a packaging box having a base part and a cover part, wherein the base part comprises a lower wall and a plurality of lateral walls, and wherein the cover part comprises an upper wall and a corresponding plurality of lateral walls;
a stack of flat glass substrates with interlayers therebetween, wherein the stack is directly or indirectly on the lower wall; and
a lateral space between the stack and the plurality of lateral walls of the base part, wherein the interlayers protrude beyond the flat substrates and into the lateral space,
wherein the interlayers have a lower surface with a higher surface roughness than an upper surface.