US 12,441,140 B2
Solid tire and method for manufacturing same
Hisaki Kato, Aichi (JP); Yoichi Miwa, Aichi (JP); Satoru Asano, Aichi (JP); and Hiroaki Sato, Kanagawa (JP)
Assigned to The Yokohama Rubber Co., LTD., Tokyo (JP)
Appl. No. 18/721,817
Filed by The Yokohama Rubber Co., LTD., Kanagawa (JP); and AICHI TIRE INDUSTRY CO., LTD., Aichi (JP)
PCT Filed Nov. 14, 2022, PCT No. PCT/JP2022/042193
§ 371(c)(1), (2) Date Jun. 19, 2024,
PCT Pub. No. WO2023/119941, PCT Pub. Date Jun. 29, 2023.
Claims priority of application No. 2021-210774 (JP), filed on Dec. 24, 2021.
Prior Publication US 2024/0416686 A1, Dec. 19, 2024
Int. Cl. B60C 19/00 (2006.01); B29D 30/02 (2006.01); B60C 7/00 (2006.01); B60C 7/10 (2006.01)
CPC B60C 19/00 (2013.01) [B29D 30/02 (2013.01); B60C 7/00 (2013.01); B60C 7/102 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A solid tire, comprising:
a tread rubber layer on a road contact surface side of the solid tire, the road contact surface side being configured to contact a road; and
a base rubber layer on a rim side of the solid tire, the rim side being configured to contact a rim when the solid tire is mounted on a rim;
the base rubber layer having JIS-A hardness of 80 or higher, and
an RFID tag being embedded in the base rubber layer; wherein
a distance between the RFID tag and a side surface of the base rubber layer ranges from 0.5 mm to 10.0 mm,
the RFID tag is disposed at a position deviating from a rim slippage region defined within a range of −15% to +15% of a rim flange height with an apex of a rim flange as a center, and
the RFID tag is disposed radially inward of the rim slippage region.