US 12,441,097 B2
Lamination process, and manufacturing method of semiconductor package using a chuck
Wei-Jie Huang, Hsinchu (TW); Yu-Ching Lo, Hsinchu (TW); Ching-Pin Yuan, Hsinchu (TW); Wen-Chih Lin, Hsinchu (TW); Cheng-Yu Kuo, Kaohsiung (TW); Yi-Yang Lei, Taichung (TW); and Ching-Hua Hsieh, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Feb. 29, 2024, as Appl. No. 18/590,965.
Application 18/590,965 is a division of application No. 17/395,440, filed on Aug. 5, 2021, granted, now 11,993,066.
Claims priority of provisional application 63/168,274, filed on Mar. 31, 2021.
Prior Publication US 2024/0198651 A1, Jun. 20, 2024
Int. Cl. H01L 23/00 (2006.01); B32B 38/18 (2006.01); H01L 21/48 (2006.01)
CPC B32B 38/1858 (2013.01) [H01L 21/4857 (2013.01); H01L 24/96 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A lamination method for lamination of a film material, comprising:
providing a lamination chuck comprising a support layer, a top layer disposed on the support layer and a base, wherein the support layer and the top layer are stacked on the base, the base comprises a body having a through hole formed therethrough and an insulation wall protruding from the body towards the support layer as well as encircling the through hole, the top layer includes a polymeric material having a Shore A hardness lower than a Shore hardness of a material of the support layer, the top layer and the support layer have at least one vacuum channel formed therethrough, vertically extending from a top surface of the top layer to a bottom surface of the support layer, wherein the through hole is in fluidic communications with the at least one vacuum channel, a hemicylindrical concavity is formed at an outer side edge of the top layer, the hemicylindrical concavity extends from the top surface of the top layer to an opposite bottom surface of the top layer, the outer side edge connects the top surface of the top layer to the bottom surface of the top layer, the through hole is formed in the support layer aligned to the hemicylindrical concavity, and a threaded hole is formed in the body of the base, aligned to the through hole of the support layer; and
applying suction to the vacuum channel, whereby the film material is on a front surface of the lamination chuck; and
transferring the film material on the lamination chuck to a substrate.