	US 12,441,065 B2
	Formed article, welding method, and method of manufacturing formed article
Kenta Hiwatashi, Tokyo (JP)
Assigned to ASAHI KASEI KABUSHIKI KAISHA, Tokyo (JP)
Appl. No. 18/285,533
Filed by ASAHI KASEI KABUSHIKI KAISHA, Tokyo (JP)
PCT Filed Jan. 23, 2023, PCT No. PCT/JP2023/001843 § 371(c)(1), (2) Date Oct. 4, 2023, PCT Pub. No. WO2023/203819, PCT Pub. Date Oct. 26, 2023.
Claims priority of application No. 2022-070984 (JP), filed on Apr. 22, 2022.
Prior Publication US 2025/0042095 A1, Feb. 6, 2025
Int. Cl. B29C 65/16 (2006.01); B29C 65/00 (2006.01); B32B 27/08 (2006.01); B32B 27/20 (2006.01); B32B 27/34 (2006.01); C08K 3/016 (2018.01); C08K 7/14 (2006.01); C08L 77/00 (2006.01); B29K 77/00 (2006.01); B29K 105/16 (2006.01)

CPC B29C 65/1638 (2013.01) [B29C 66/71 (2013.01); B29C 66/73365 (2013.01); B29C 66/7392 (2013.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 27/34 (2013.01); C08K 3/016 (2018.01); C08K 7/14 (2013.01); C08L 77/00 (2013.01); B29K 2077/00 (2013.01); B29K 2105/16 (2013.01); B29K 2995/0016 (2013.01); B29K 2995/0026 (2013.01); B32B 2307/3065 (2013.01); B32B 2307/412 (2013.01); C08L 2205/025 (2013.01)]

15 Claims

1. A formed article obtained by performing laser welding on a transmitting resin member and an absorbing resin member, the formed article comprising:

a bonded part where the transmitting resin member and the absorbing resin member are bonded to each other by the laser welding,

wherein a molten pool is observed at the bonded part in a cross section that includes a normal to the transmitting resin member or the absorbing resin member and is orthogonal to a scanning direction of a laser beam,

an area of the molten pool is 0.210 mm²or more and 1.00 mm²or less,

the transmitting resin member and the absorbing resin member are each molded from a resin composition,

the resin composition contains a thermoplastic resin,

the thermoplastic resin contains at least a polyamide-based resin (A1), and

a glass transition point temperature of the resin composition is 85° C. or higher.