US 12,440,943 B2
Method and apparatus for polishing wafer
Masaaki Oseki, Nishigo-mura (JP); Tatsuo Abe, Shirakawa (JP); and Michito Sato, Nishigo-mura (JP)
Assigned to SHIN-ETSU HANDOTAI CO., LTD., Tokyo (JP)
Appl. No. 17/917,781
Filed by SHIN-ETSU HANDOTAI CO., LTD., Tokyo (JP)
PCT Filed Feb. 8, 2021, PCT No. PCT/JP2021/004538
§ 371(c)(1), (2) Date Oct. 7, 2022,
PCT Pub. No. WO2021/205740, PCT Pub. Date Oct. 4, 2021.
Claims priority of application No. 2020-070282 (JP), filed on Apr. 9, 2020.
Prior Publication US 2023/0137813 A1, May 4, 2023
Int. Cl. B24B 37/04 (2012.01); B24B 37/005 (2012.01); B24B 49/02 (2006.01); B24B 49/04 (2006.01); B24B 57/02 (2006.01); C09G 1/02 (2006.01); H01L 21/02 (2006.01); H01L 21/304 (2006.01); H01L 21/306 (2006.01); H01L 21/67 (2006.01)
CPC B24B 37/044 (2013.01) [B24B 37/005 (2013.01); B24B 37/042 (2013.01); B24B 49/02 (2013.01); B24B 49/04 (2013.01); B24B 57/02 (2013.01); C09G 1/02 (2013.01); H01L 21/02024 (2013.01); H01L 21/304 (2013.01); H01L 21/30625 (2013.01); H01L 21/67092 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A method for polishing a wafer in order to correct a shape of a polished wafer subjected to polishing, by pressing the wafer to a polishing pad while continuously supplying a composition for polishing containing water to perform correction-polishing, the method comprising the steps of:
measuring the shape of the polished wafer before performing the correction-polishing;
determining, in accordance with the measured shape of the polished wafer, a kind and concentration of a surfactant to be contained in the composition for polishing; and
performing the correction-polishing of the polished wafer whose shape was measured while supplying the composition for polishing adjusted on a basis of the determined kind and concentration of the surfactant.