US 12,440,937 B2
Measurement device, additive manufacturing system, and cutting machining system
Shigenobu Asada, Tokyo (JP)
Assigned to MITSUBISHI ELECTRIC CORPORATION, Tokyo (JP)
Appl. No. 18/294,188
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
PCT Filed Aug. 10, 2021, PCT No. PCT/JP2021/029486
§ 371(c)(1), (2) Date Feb. 1, 2024,
PCT Pub. No. WO2023/017557, PCT Pub. Date Feb. 16, 2023.
Prior Publication US 2025/0091172 A1, Mar. 20, 2025
Int. Cl. B23Q 17/24 (2006.01); B29C 64/379 (2017.01); B29C 64/393 (2017.01); B33Y 30/00 (2015.01); B33Y 40/00 (2020.01); B33Y 40/20 (2020.01); B33Y 50/02 (2015.01)
CPC B23Q 17/2471 (2013.01) [B29C 64/379 (2017.08); B29C 64/393 (2017.08); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12); B33Y 40/20 (2020.01); B33Y 50/02 (2014.12)] 15 Claims
OG exemplary drawing
 
1. A measurement device comprising:
a sensor to acquire image information by imaging an object targeted for addition of materials or cutting;
measurement circuitry to acquire measurement data by measuring the shape of the object on the basis of the image information, the measurement data representing a shape of the object;
missing region detecting circuitry to detect a missing region of the object, the missing region being a region lacking the measurement data;
measurement data complementing circuitry to acquire re-measurement data, which is measurement data about the missing region, by re-measuring the shape of the object on the basis of the image information which the sensor has acquired by re-imaging, and complement the measurement data with the re-measurement data; and
machining region specifying circuitry to specify a machining region for the addition or the cutting, on the basis of the complemented measurement data and a model of a finished product obtained by the addition or the cutting.