US 12,440,925 B2
Laser machining apparatus, laser machining method, and method for manufacturing semiconductor member
Takeshi Sakamoto, Hamamatsu (JP)
Assigned to HAMAMATSU PHOTONICS K.K., Hamamatsu (JP)
Appl. No. 18/014,495
Filed by HAMAMATSU PHOTONICS K.K., Hamamatsu (JP)
PCT Filed Mar. 29, 2021, PCT No. PCT/JP2021/013398
§ 371(c)(1), (2) Date Jan. 5, 2023,
PCT Pub. No. WO2022/014104, PCT Pub. Date Jan. 20, 2022.
Claims priority of application No. 2020-121652 (JP), filed on Jul. 15, 2020.
Prior Publication US 2023/0219172 A1, Jul. 13, 2023
Int. Cl. B23K 26/53 (2014.01); B23K 26/40 (2014.01); B23K 101/40 (2006.01); B23K 103/00 (2006.01); H10D 89/00 (2025.01)
CPC B23K 26/53 (2015.10) [B23K 26/40 (2013.01); B23K 2101/40 (2018.08); B23K 2103/56 (2018.08); H10D 89/013 (2025.01)] 11 Claims
OG exemplary drawing
 
1. A laser processing device comprising:
a light source configured to output laser light;
a space light modulator configured to modulate the laser light output from the light source in accordance with a modulation pattern and to output the modulated laser light;
a converging lens configured to form a converging spot of the laser light by converging the laser light output from the space light modulator to an object;
a movement unit configured to relatively move the converging spot with respect to the object; and
a control unit configured to relatively move, while setting a position of the converging spot in a Z direction intersecting with an incident surface of the laser light on the object at a first Z position, the converging spot along a line extended in an X direction along the incident surface by controlling at least the space light modulator and the movement unit, thereby performing a first forming process for forming a first modified region and a first fracture extended from the first modified region in the object, and configured to relatively move the converging spot along the line, while setting a position of the converging spot in the Z direction at a second Z position that is closer to the incident surface than the first Z position, thereby performing a second forming process for forming a second modified region and a second fracture extended from the second modified region, wherein
in the first forming process, the control unit sets a position of the converging spot in a Y direction along the incident surface and intersecting with the X direction, at a first Y position, and
in the second forming process, the control unit sets a position of the converging spot in the Y direction at a second Y position shifted from the first Y position, while modulating the laser light such that a beam shape of the converging spot in a YZ plane including the Y direction and the Z direction has an inclined shape that is inclined in the shift direction at least on the incident surface side with respect to the center of the converging spot by controlling the modulation pattern to be displayed on the space light modulator, thereby forming the second fracture so as to be inclined in the shift direction in the YZ plane.