US 12,440,921 B2
Laser processing apparatus and laser processing method
Akifumi Sangu, Hwaseong-si (KR); Hyoung Joo Kim, Anyang-si (KR); Jung Hwa You, Hwaseong-si (KR); and Il Young Jeong, Suwon-si (KR)
Assigned to Samsung Display Co., Ltd., Yongin-si (KR)
Filed by Samsung Display Co., LTD., Yongin-si (KR)
Filed on Aug. 16, 2022, as Appl. No. 17/888,717.
Claims priority of application No. 10-2021-0180242 (KR), filed on Dec. 16, 2021.
Prior Publication US 2023/0191533 A1, Jun. 22, 2023
Int. Cl. B23K 26/082 (2014.01); B23K 26/06 (2014.01)
CPC B23K 26/082 (2015.10) [B23K 26/0643 (2013.01); B23K 26/0648 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A laser processing apparatus comprising:
a laser source;
a width adjuster that adjusts a width of a laser beam irradiated from the laser source; and
a scanner that adjusts an irradiation direction of the laser beam having passed through the width adjuster, wherein
the width adjuster comprises a first width adjusting portion and a second width adjusting portion arranged on a traveling direction of the laser beam,
a focal length of the first width adjusting portion is equal to or greater than about 20,000 mm, and
a focal length of the second width adjusting portion is equal to or greater than about 20,000 mm.