US 12,440,883 B2
Hot stamped member
Takuya Mitsunobu, Tokyo (JP); Hiroshi Takebayashi, Tokyo (JP); and Takehiro Takahashi, Tokyo (JP)
Assigned to NIPPON STEEL CORPORATION, Tokyo (JP)
Appl. No. 18/252,541
Filed by NIPPON STEEL CORPORATION, Tokyo (JP)
PCT Filed Jan. 14, 2022, PCT No. PCT/JP2022/001102
§ 371(c)(1), (2) Date May 11, 2023,
PCT Pub. No. WO2022/154081, PCT Pub. Date Jul. 21, 2022.
Claims priority of application No. 2021-004022 (JP), filed on Jan. 14, 2021.
Prior Publication US 2024/0001423 A1, Jan. 4, 2024
Int. Cl. B32B 15/04 (2006.01); B21D 22/02 (2006.01); B32B 17/06 (2006.01); C22C 30/06 (2006.01); C22C 38/00 (2006.01); C22C 38/02 (2006.01); C23C 2/04 (2006.01)
CPC B21D 22/022 (2013.01) [C22C 30/06 (2013.01); C22C 38/002 (2013.01); C22C 38/02 (2013.01); C23C 2/04 (2013.01)] 3 Claims
OG exemplary drawing
 
1. A hot stamped member comprising:
a steel; and
a plating layer formed on the steel,
wherein the plating layer contains, as a chemical composition, by mass %,
Zn: 0.5% to 15.0%,
Mg: 0% to 10.0%,
Si: 0.05% to 10.0%,
Fe: 20.0% to 60.0%,
0% to 5.00% in total of one or two or more selected from
Ca: 0% to 3.00%,
Sb: 0% to 0.50%,
Pb: 0% to 0.50%,
Sr: 0% to 0.50%,
Sn: 0% to 1.00%,
Cu: 0% to 1.00%,
Ti: 0% to 1.00%,
Ni: 0% to 1.00%,
Mn: 0% to 1.00%,
Cr: 0% to 1.00%,
La: 0% to 1.00%,
Ce: 0% to 1.00%,
Zr: 0% to 1.00%, and
Hf: 0% to 1.00%, and
a remainder of Al and impurities,
the plating layer contains a Zn-based oxide including one or two of a Zn oxide and a Zn—Mg oxide having a size of 1.0 μm or more and 10.0 μm or less in a thickness direction of the plating layer and 0.1 μm or more in a direction perpendicular to the thickness direction, and
in a cross section of the plating layer in the thickness direction, when a length of an interface between the plating layer and the steel is indicated as Le, a sum of lengths of the Zn-based oxide projected onto the interface from an upper surface of the plating layer is indicated as ΣLi, and a sum of lengths of portions of the Zn-based oxide in contact with the plating layer projected onto the interface from the upper surface of the plating layer is indicated as ΣLai, Expressions (1) and (2) are satisfied,
ΣLi/Le≥0.10  (1)
ΣLai/ΣLi≥0.50  (2).