US 12,440,268 B2
Semiconductor light source hair removal device with optimized heat dissipation
Shaohui Pan, Guangdong (CN); and Jian Liu, Guangdong (CN)
Assigned to Shenzhen LeafLife Tech. Co., Ltd., Shenzhen (CN)
Appl. No. 17/918,036
Filed by SHENZHEN LEAFLIFE TECH. CO., LTD., Guangdong (CN)
PCT Filed Mar. 8, 2022, PCT No. PCT/CN2022/079797
§ 371(c)(1), (2) Date Oct. 10, 2022,
PCT Pub. No. WO2022/188787, PCT Pub. Date Sep. 15, 2022.
Claims priority of application No. 202120488512.2 (CN), filed on Mar. 8, 2021.
Prior Publication US 2023/0129185 A1, Apr. 27, 2023
Int. Cl. A61B 18/20 (2006.01); A61B 18/00 (2006.01)
CPC A61B 18/203 (2013.01) [A61B 2018/00017 (2013.01); A61B 2018/00476 (2013.01); A61B 2018/00922 (2013.01); A61B 2018/202 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A semiconductor light source hair removal device with optimized heat dissipation, comprising a housing, a hair removal assembly fixed to the housing, a fan, a circuit board, and a control power board, wherein
the housing is provided with an accommodating cavity for accommodating the fan, the circuit board and the control power board, and at least one heat dissipation port is defined in the housing;
the hair removal assembly, the fan and the control power board are electrically connected to the circuit board;
the hair removal assembly comprises a treatment head, a thermoelectric cooler, a light source chip and a heat dissipation component;
the thermoelectric cooler comprises a cold side and a hot side, the cold side is attached to the treatment head;
the heat dissipation component comprises heat sink fins and at least one heat pipe connected to the heat sink fins; and
the hot side of the thermoelectric cooler and the light source chip both are attached to the at least one heat pipe, so that heat generated by the light source chip and the thermoelectric cooler is transferred to the heat sink fins for dissipation through the at least one heat pipe during use.