US 12,440,088 B2
Encapsulated components of medical devices, and methods therefor
Adam Michael Larouche, Indianapolis, IN (US); Kirsten Viering, Newton, MA (US); John B. Golden, Norton, MA (US); Scott Kippenbrock, Avon, IN (US); Adam Dills, Bloomington, IN (US); and Seth Charles Schneider, Jeffersonville, IN (US)
Assigned to Boston Scientific Scimed, Inc., Maple Grove, MN (US)
Filed by Boston Scientific Scimed, Inc., Maple Grove, MN (US)
Filed on May 12, 2023, as Appl. No. 18/316,634.
Application 18/316,634 is a continuation of application No. 16/454,224, filed on Jun. 27, 2019, granted, now 11,700,992.
Claims priority of provisional application 62/691,045, filed on Jun. 28, 2018.
Prior Publication US 2023/0277037 A1, Sep. 7, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. A61B 1/00 (2006.01); A61B 1/05 (2006.01); A61B 1/06 (2006.01)
CPC A61B 1/0008 (2013.01) [A61B 1/00066 (2013.01); A61B 1/00096 (2013.01); A61B 1/0011 (2013.01); A61B 1/05 (2013.01); A61B 1/0661 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A distal end portion of a medical device, comprising:
a component, wherein the component includes (1) a light source and (2) an image capturing component, wherein the image capturing component includes a lens, the lens including a side-facing surface between a distal end of the distal end portion and a proximal end of the distal end portion;
an encapsulation, wherein the encapsulation includes a first portion, a second portion adjacent to and proximal to the first portion, and a third portion adjacent to and proximal to the second portion, wherein a largest cross-sectional dimension of the first portion of the encapsulation measured perpendicular to a longitudinal axis of the distal end portion is greater than a largest cross-sectional dimension of the second portion of the encapsulation measured perpendicular to the longitudinal axis, wherein the largest cross-sectional dimension of the second portion of the encapsulation is greater than a largest cross-sectional dimension of the third portion of the encapsulation measured perpendicular to the longitudinal axis, wherein the longitudinal axis extends from the proximal end of the distal end portion to the distal end of the distal end portion; and
a circuit board, wherein inner surfaces of the encapsulation contact and at least partially encompass the circuit board, wherein a shape of the inner surfaces is a mirror image of a shape of exterior surfaces of the circuit board;
wherein the inner surfaces of the encapsulation contact and at least partially encompass the component, and wherein a shape of the inner surfaces is a mirror image of a shape of exterior surfaces of the component that are contacted by the inner surfaces of the encapsulation.