US 12,440,000 B2
Upper and shoe including the same
Chihaya Suzuki, Hyogo (JP); Seiji Yano, Hyogo (JP); Hiroki Nakamura, Hyogo (JP); Satoru Abe, Hyogo (JP); and Sho Takamasu, Hyogo (JP)
Assigned to ASICS CORPORATION, Hyogo (JP)
Appl. No. 18/272,976
Filed by ASICS CORPORATION, Hyogo (JP)
PCT Filed Jan. 21, 2021, PCT No. PCT/JP2021/001978
§ 371(c)(1), (2) Date Jul. 18, 2023,
PCT Pub. No. WO2022/157875, PCT Pub. Date Jul. 28, 2022.
Prior Publication US 2024/0081481 A1, Mar. 14, 2024
Int. Cl. A43B 23/02 (2006.01)
CPC A43B 23/0245 (2013.01) 12 Claims
OG exemplary drawing
 
1. An upper comprising
an upper body covering an instep of a foot, wherein
the upper body includes a first layer, a second layer disposed with a gap from the first layer, and a third layer connecting the first layer and the second layer,
the upper body includes a standard region, a non-hole region having a lower stiffness than the standard region, and a low stiffness region having a lower stiffness than the non-hole region,
the first layer and the second layer have no hole in the standard region,
the third layer is not disposed in the non-hole region,
the first layer and the second layer have no hole in the non-hole region,
the third layer is not disposed in the low stiffness region,
at least one hole is disposed in each of the first layer and the second layer in the low stiffness region, and
the at least one hole in the first layer and the at least one hole in the second layer are disposed at a corresponding position in the low stiffness region.