US 12,114,568 B2
Method for manufacturing thermoelectric conversion module
Yuta Seki, Kawasaki (JP); Kunihisa Kato, Warabi (JP); Wataru Morita, Saitama (JP); and Mutsumi Masumoto, Beppu (JP)
Assigned to LINTEC CORPORATION, Tokyo (JP)
Appl. No. 18/034,430
Filed by LINTEC CORPORATION, Tokyo (JP)
PCT Filed Oct. 28, 2021, PCT No. PCT/JP2021/039751
§ 371(c)(1), (2) Date Apr. 28, 2023,
PCT Pub. No. WO2022/092178, PCT Pub. Date May 5, 2022.
Claims priority of application No. 2020-182610 (JP), filed on Oct. 30, 2020.
Prior Publication US 2024/0023441 A1, Jan. 18, 2024
Int. Cl. H10N 10/01 (2023.01); H10N 10/17 (2023.01); H10N 10/857 (2023.01)
CPC H10N 10/01 (2023.02) [H10N 10/17 (2023.02); H10N 10/857 (2023.02)] 11 Claims
OG exemplary drawing
 
1. A method for manufacturing a thermoelectric conversion module, the method comprising the following steps (A) to (D):
(A) disposing a chip of a P-type thermoelectric conversion material and a chip of an N-type thermoelectric conversion material on a support so as to be spaced apart from each other;
(B) filling an insulator between the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material to obtain an integrated body including the chip of the P-type thermoelectric conversion material, the chip of the N-type thermoelectric conversion material, and the insulator;
(C) peeling the integrated body obtained in step (B) from the support; and
(D) connecting the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material via an electrode in the integrated body after step (C).