US 12,114,546 B2
Array substrate including connection layer and display panel having the same
Ruonan Wang, Shenzhen (CN)
Assigned to SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD., Shenzhen (CN)
Appl. No. 17/427,612
Filed by SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD., Shenzhen (CN)
PCT Filed Jul. 16, 2021, PCT No. PCT/CN2021/106810
§ 371(c)(1), (2) Date Jul. 30, 2021,
PCT Pub. No. WO2022/267115, PCT Pub. Date Dec. 29, 2022.
Claims priority of application No. 202110691882.0 (CN), filed on Jun. 22, 2021.
Prior Publication US 2024/0040864 A1, Feb. 1, 2024
Int. Cl. H01L 29/08 (2006.01); H10K 59/122 (2023.01); H10K 59/131 (2023.01); H10K 59/80 (2023.01); H10K 102/00 (2023.01); H10K 102/10 (2023.01)
CPC H10K 59/131 (2023.02) [H10K 59/122 (2023.02); H10K 59/80517 (2023.02); H10K 2102/102 (2023.02); H10K 2102/103 (2023.02); H10K 2102/351 (2023.02)] 19 Claims
OG exemplary drawing
 
1. An array substrate, comprising:
a substrate;
a planarization layer disposed on a side of the substrate and provided with a first via hole;
a connection layer comprising a connecting portion, wherein the connecting portion is disposed in the first via hole and extends to a surface of the planarization layer; and
an anode layer disposed on a surface of the connecting portion away from the planarization layer,
wherein the connecting portion comprises:
a first sub-connecting portion covering the first via hole; and
a second sub-connecting portion disposed on the surface of the planarization layer, wherein there is a gap between the first sub-connecting portion and the second sub-connecting portion, the anode layer covers the first sub-connecting portion, the second sub-connecting portion, and a part of the planarization layer located at the gap, and the first sub-connecting portion and the second sub-connecting portion are connected by the anode layer.