US 12,114,468 B2
High-availability liquid cooling system for chip and server
Tianyi Gao, San Jose, CA (US)
Assigned to BAIDU USA LLC, Sunnyvale, CA (US)
Filed by Baidu USA LLC, Sunnyvale, CA (US)
Filed on Mar. 22, 2022, as Appl. No. 17/700,755.
Prior Publication US 2023/0309270 A1, Sep. 28, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20809 (2013.01) [H05K 7/20309 (2013.01); H05K 7/20327 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A cooling device for cooling a chip, comprising:
a cooling layer attached to the chip and including a first cooling region and a second cooling region; and
an internal region positioned on top of the cooling layer, wherein the internal region includes a vapor separation core;
wherein the first cooling region generates mixed fluid from two-phase coolant due to heat extracted from the chip,
wherein the vapor separation core operates to extract at least a portion of vapor from the mixed fluid,
wherein the mixed fluid with the at least portion of vapor extracted is distributed to the second cooling region, and
wherein the first cooling region and the second cooling region are created by a first divider, wherein the first divider substantially blocks the two-phase coolant and the mixed fluid in each cooling region from directly entering another cooling region.