US 12,114,466 B2
Heat pipe with in-plane heat spreader and loading mechanism
Penchala Pratap Binni Boyina, Bangalore (IN); Kathiravan D, Bangalore (IN); Babu Triplicane Gopikrishnan, Bangalore (IN); Prakash Kurma Raju, Bangalore (IN); Deepak Sekar, Bangalore (IN); and Hari Shanker Thakur, Bangalore (IN)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Dec. 23, 2020, as Appl. No. 17/132,477.
Prior Publication US 2021/0112684 A1, Apr. 15, 2021
Int. Cl. H05K 7/20 (2006.01); F28D 15/04 (2006.01); G06F 1/20 (2006.01); H01L 23/40 (2006.01); H01L 23/427 (2006.01)
CPC H05K 7/20336 (2013.01) [F28D 15/04 (2013.01); G06F 1/203 (2013.01); H01L 23/4006 (2013.01); H01L 23/427 (2013.01); H01L 2023/4087 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device comprising:
one or more heat pipes thermally coupled to one or more heat sources;
a heat spreader coupled to the one or more heat pipes, wherein the heat spreader is in-plane with the heat pipe; and
one or more loading mechanisms coupled to at least a portion of the one or more heat pipes, wherein the one or more loading mechanisms are in-plane with the heat spreader and the one or more heat pipes and the one or more loading mechanisms are comprised of a relatively high expansion material and of a relatively low expansion material.