US 12,114,453 B2
Core shell with various filler materials for enhanced thermal conductivity
William A. Counts, Sunnyvale, CA (US); Andrew W. Meschke, San Jose, CA (US); Lei Gao, Shanghai (CN); Abhijeet Misra, Sunnyvale, CA (US); Alexander W. Williams, Santa Clara, CA (US); Hoishun Li, San Jose, CA (US); Lee E. Hooton, Ridge, NY (US); Michael B. Wittenberg, San Francisco, CA (US); and James A. Yurko, Saratoga, CA (US)
Assigned to APPLE INC., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Jun. 21, 2019, as Appl. No. 16/449,061.
Claims priority of provisional application 62/798,343, filed on Jan. 29, 2019.
Prior Publication US 2020/0245487 A1, Jul. 30, 2020
Int. Cl. H05K 5/04 (2006.01); A45C 11/00 (2006.01); G06F 1/16 (2006.01); H04M 1/02 (2006.01); H05K 5/00 (2006.01); H05K 5/02 (2006.01); H05K 5/03 (2006.01)
CPC H05K 5/04 (2013.01) [A45C 11/00 (2013.01); G06F 1/1626 (2013.01); H04M 1/0283 (2013.01); H05K 5/0004 (2013.01); H05K 5/0213 (2013.01); H05K 5/03 (2013.01); A45C 2011/002 (2013.01); G06F 2200/1633 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A housing of an electronic device, comprising:
an elongate shell including a first metal having a first set of material properties and a surface having a substantially curved shape, the surface at least partially defining an exterior surface of the electronic device, the elongate_shell defining an engagement feature; and
an interior portion including a second metal having a second set of material properties independent of the first set of material properties and at least partially defining the engagement feature, the interior portion being bonded to the first metal of the elongate shell and disposed interior to the surface;
wherein the engagement feature defines a through hole having a central axis extending longitudinally along the elongate shell, the through hole defined and surrounded by the elongate shell and the interior portion.