US 12,114,436 B2
Composite circuit board and method of manufacturing the same
Zhicheng Yang, Shenzhen (CN); Xianyou Deng, Shenzhen (CN); Jinfeng Liu, Shenzhen (CN); Hegen Zhang, Shenzhen (CN); Tao Luo, Shenzhen (CN); and Zhishen Wang, Shenzhen (CN)
Assigned to SHENNAN CIRCUITS CO., LTD., Shenzhen (CN)
Filed by SHENNAN CIRCUITS CO., LTD., Shenzhen (CN)
Filed on Nov. 10, 2022, as Appl. No. 18/054,157.
Application 18/054,157 is a continuation of application No. PCT/CN2020/136220, filed on Dec. 14, 2020.
Claims priority of application No. 202010942728.1 (CN), filed on Sep. 9, 2020.
Prior Publication US 2023/0072239 A1, Mar. 9, 2023
Int. Cl. H05K 3/36 (2006.01); H05K 1/14 (2006.01); H05K 3/46 (2006.01)
CPC H05K 3/361 (2013.01) [H05K 1/142 (2013.01); H05K 3/4611 (2013.01); H05K 2201/09163 (2013.01); H05K 2203/061 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A composite circuit board, comprising: a flexible board, a rigid board, an adhesive layer and a protective adhesive,
wherein the adhesive layer is disposed between the rigid board and the flexible board and configured to bond the rigid board with the flexible board;
the rigid board defines a stepped groove that extends through the rigid board, the adhesive layer defines a through slot that extends through the adhesive layer, the stepped groove and the through slot are communicated with each other to form a thinning groove;
the flexible board is exposed from the thinning groove;
the protective adhesive covers at least one stepped wall of the thinning groove and at least a part of an exposed region of the flexible board;
a height of one of the at least one stepped wall adjacent to the flexible board is in a range of 0.05 mm to 0.5 mm in a lamination direction of the composite circuit board; and
a width of an orthographic projection of each of the at least one stepped wall onto the flexible board in a direction perpendicular to the lamination direction is in a range of 0.5 mm to 2.5 mm.