CPC H05K 13/046 (2013.01) [H05K 13/0015 (2013.01)] | 16 Claims |
1. An electronic device comprising:
an electronic component having a base material and a terminal electrode disposed on a first surface of the base material; and
a circuit substrate in which a pad for mounting the electronic component is disposed on a first surface of the circuit substrate,
wherein the electronic component has a through hole extending from the first surface of the base material of the electronic component to a second surface opposite the first surface of the base material, the through hole electrically connecting the terminal electrode and a conductor pattern disposed on the second surface of the base material,
wherein the pad and the terminal electrode are electrically and mechanically connected to each other with a cured product of an optical firing paste that is disposed between the terminal electrode and a conductor pattern disposed on the first surface of the circuit substrate,
wherein the pad is configured to prevent light from passing therethrough, and
wherein the base material comprises a material that prevents light from passing therethrough.
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