US 12,114,428 B2
Electronic component embedded substrate
Yun Je Ji, Suwon-si (KR); Yong Hoon Kim, Suwon-si (KR); and Seung Eun Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Sep. 13, 2022, as Appl. No. 17/943,603.
Claims priority of application No. 10-2021-0132445 (KR), filed on Oct. 6, 2021.
Prior Publication US 2023/0108748 A1, Apr. 6, 2023
Int. Cl. H05K 1/18 (2006.01); H05K 1/11 (2006.01)
CPC H05K 1/183 (2013.01) [H05K 1/113 (2013.01); H05K 2201/0166 (2013.01); H05K 2201/09036 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic component embedded substrate comprising:
an insulating material including a cavity disposed in one surface thereof;
a protective layer embedded in the insulating material and covering an entire bottom surface of the cavity;
solders disposed on side surfaces of the cavity; and
an electronic component disposed in the cavity and at least partially in contact with the solders,
wherein the protective layer has a material different from that of the insulating material, and
wherein the protective layer includes an insulative material.