	US 12,114,427 B2
	Method for fabricating assemble substrate
Lung-Yuan Wang, Taichung (TW); and Wen-Liang Lien, Taichung (TW)
Assigned to Siliconware Precision Industries Co., Ltd., Taichung (TW)
Filed by Siliconware Precision Industries Co., Ltd., Taichung (TW)
Filed on Jun. 2, 2022, as Appl. No. 17/831,301.
Application 17/831,301 is a division of application No. 16/589,663, filed on Oct. 1, 2019, granted, now 11,382,214.
Claims priority of application No. 108129257 (TW), filed on Aug. 16, 2019.
Prior Publication US 2022/0304157 A1, Sep. 22, 2022
Int. Cl. H05K 3/32 (2006.01); H01L 23/31 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01); H05K 1/02 (2006.01)

CPC H05K 1/144 (2013.01) [H01L 23/3157 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 3/32 (2013.01); H05K 3/4682 (2013.01); H05K 1/0203 (2013.01); H05K 2201/042 (2013.01)]

11 Claims

1. A method for fabricating an assemble substrate, comprising:

providing a plurality of circuit members and at least one circuit portion on a carrying board, and electrically connecting the circuit portion to the plurality of circuit members, wherein the plurality of circuit members are spaced apart from one another, wherein the circuit portion is stacked on two of the plurality of circuit members, wherein the circuit portion and the plurality of circuit members are circuit boards, and wherein the circuit portion has a first width less than or equal to a second width between two of the plurality of circuit members, with the second width being greater than a width between any other two of the plurality of circuit members; and

removing the carrying board.