US 12,114,425 B2
Cable assembly, signal transmission structure, and electronic device
Guodong Zhang, Dongguan (CN); Chong Chen, Dongguan (CN); Jian Zhang, Dongguan (CN); Shaoyong Xiang, Dongguan (CN); Zhijun Qu, Dongguan (CN); and Changxing Sun, Nanjing (CN)
Assigned to HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)
Filed by Huawei Technologies Co., Ltd., Shenzhen (CN)
Filed on Sep. 12, 2022, as Appl. No. 17/942,442.
Application 17/942,442 is a continuation of application No. PCT/CN2021/072568, filed on Jan. 18, 2021.
Claims priority of application No. 202010178016.7 (CN), filed on Mar. 13, 2020.
Prior Publication US 2023/0007773 A1, Jan. 5, 2023
Int. Cl. H05K 1/00 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/116 (2013.01) [H05K 1/184 (2013.01); H05K 2201/09509 (2013.01); H05K 2201/10901 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A signal transmission structure comprising:
a circuit board comprising:
a plurality of conductive holes;
a first side comprising a first surface; and
a second side comprising a second surface;
a chip assembled on the first surface and electrically coupled to each of the conductive holes, wherein the second side is away from the chip; and
a cable assembly that is assembled on the second surface, that is configured to implement signal transmission with the chip, and that comprises:
a plurality of cables that is electrically coupled to the conductive holes;
a base comprising a third surface comprising one or more conductive parts configured to be grounded; and
a plurality of cable units installed on the base, wherein each of the cable units comprises a grounding part electrically coupled to the one or more conductive parts, and
wherein the chip further comprises a ground pin electrically coupled to the one or more conductive parts using a corresponding one of the conductive holes.