US 12,114,129 B2
Bone conduction microphone
Wenbing Zhou, Shenzhen (CN); Yongshuai Yuan, Shenzhen (CN); Wenjun Deng, Shenzhen (CN); Xin Qi, Shenzhen (CN); and Fengyun Liao, Shenzhen (CN)
Assigned to SHENZHEN SHOKZ CO., LTD., Shenzhen (CN)
Filed by SHENZHEN SHOKZ CO., LTD., Guangdong (CN)
Filed on May 25, 2022, as Appl. No. 17/664,875.
Application 17/664,875 is a continuation of application No. PCT/CN2020/142538, filed on Dec. 31, 2020.
Claims priority of application No. 202010051694.7 (CN), filed on Jan. 17, 2020; application No. PCT/CN2020/079809 (WO), filed on Mar. 18, 2020; and application No. PCT/CN2020/103201 (WO), filed on Jul. 21, 2020.
Prior Publication US 2022/0286772 A1, Sep. 8, 2022
Int. Cl. H04R 1/46 (2006.01); H04R 1/08 (2006.01); H04R 1/28 (2006.01)
CPC H04R 1/46 (2013.01) [H04R 1/083 (2013.01); H04R 1/2876 (2013.01); H04R 2460/13 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A bone conduction microphone, comprising:
a laminated structure formed by a vibration unit and an acoustic transducer unit;
a base structure configured to carry the laminated structure, at least one side of the laminated structure being physically connected to the base structure, wherein
the base structure vibrates based on an external vibration signal,
the vibration unit is deformed in response to the vibration of the base structure,
the acoustic transducer unit generates an electrical signal based on the deformation of the vibration unit; and
at least one damping structural layer which is arranged on an upper surface, a lower surface, and/or an interior of the laminated structure, and connected to the base structure, wherein the base structure includes an inner-hollow frame structure, one end of the laminated structure is connected to the base structure or the at least one damping structural layer, and the other end of the laminated structure is suspended in a hollow position of the base structure.