US 12,114,120 B2
Earphone housing and earphone
Yasuaki Takano, Kikugawa (JP); Hiroyuki Ayame, Hamamatsu (JP); Tomoaki Mori, Hamamatsu (JP); Kazuki Kashiwase, Kodaira (JP); and Sena Otsuka, Hamamatsu (JP)
Assigned to Yamaha Corporation, Hamamatsu (JP)
Filed by Yamaha Corporation, Hamamatsu (JP)
Filed on Oct. 11, 2022, as Appl. No. 17/963,550.
Claims priority of application No. 2021-167223 (JP), filed on Oct. 12, 2021.
Prior Publication US 2023/0111906 A1, Apr. 13, 2023
Int. Cl. H04R 1/10 (2006.01)
CPC H04R 1/1016 (2013.01) [H04R 2420/07 (2013.01)] 9 Claims
OG exemplary drawing
 
1. An earphone housing comprising:
an inserter that is configured to be inserted into an outer ear hole of an ear of a user; and
a main body that is coupled to the inserter, wherein:
the main body includes:
a bottom surface that is configured to contact a surface of a cavum concha of the ear; and
a side surface that is configured to contact a tragus of the ear and an antitragus of the ear;
the side surface includes a depressed part that is depressed inward and is configured to contact a top of the antitragus, and
the side surface is configured to contact the tragus with a part other than the depressed part.