| CPC H04L 25/0278 (2013.01) [H01L 23/64 (2013.01)] | 18 Claims |
|
1. A semiconductor apparatus comprising:
a based chip; and
a first core chip stacked on the base chip and coupled to the base chip,
wherein the base chip comprises:
a calibration circuit configured to generate a plurality of calibration signals by being coupled to a plurality of reference resistors and performing calibration operations;
a first control circuit configured to select one of the plurality of calibration signals based on a first impedance setting signal to generate a first impedance control signal; and
a first data circuit configured to receive first data from the first core chip and transmit the first data to an external device, or configured to receive the first data from the external device and transmit the first data to the first core chip, and configured to set an impedance based on the first impedance control signal.
|