US 12,113,566 B2
Radio frequency module
Shou Matsumoto, Kyoto (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed on Nov. 4, 2020, as Appl. No. 17/088,929.
Application 17/088,929 is a continuation of application No. PCT/JP2019/028247, filed on Jul. 18, 2019.
Claims priority of application No. 2018-137535 (JP), filed on Jul. 23, 2018.
Prior Publication US 2021/0050876 A1, Feb. 18, 2021
Int. Cl. H04B 1/40 (2015.01); H05K 1/02 (2006.01)
CPC H04B 1/40 (2013.01) [H05K 1/0213 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10984 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A radio frequency module comprising:
a first circuit component being a transmission-only component configured to process only a transmission signal;
a second circuit component being a transmission-reception dual-use component configured to process both the transmission signal and a reception signal; and
a third circuit component different than the first circuit component and the second circuit component, the third circuit component being a reception-only component configured to process only the reception signal,
wherein the first circuit component is mounted on a first main surface, the first main surface being a main surface of a first module board,
wherein the second circuit component is mounted on a second main surface in a stacking direction of the first module board or the second module board, the second main surface being different than the first main surface,
wherein the third circuit component is mounted on a third main surface, the third main surface being a main surface of the second module board and different than the first and second main surfaces,
wherein the first and third main surfaces face away from each other, and
wherein the third main surface comprises a first mounting structure configured to mount the radio frequency module on an external board.