US 12,113,557 B2
Radio frequency module and communication device
Shinya Hitomi, Nagaokakyo (JP); Yuichi Tannan, Nagaokakyo (JP); and Hirotsugu Mori, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed on Jun. 12, 2023, as Appl. No. 18/333,099.
Application 18/333,099 is a continuation of application No. 17/660,641, filed on Apr. 26, 2022, granted, now 11,722,159.
Application 17/660,641 is a continuation of application No. 17/066,772, filed on Oct. 9, 2020, granted, now 11,349,508, issued on May 31, 2022.
Claims priority of application No. 2019-188470 (JP), filed on Oct. 15, 2019.
Prior Publication US 2023/0327688 A1, Oct. 12, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H04B 1/00 (2006.01); H04B 1/16 (2006.01)
CPC H04B 1/0078 (2013.01) [H04B 1/006 (2013.01); H04B 1/1615 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A radio frequency module, comprising:
an antenna terminal;
a first input/output terminal;
a second input/output terminal;
a first filter circuit disposed on a first path and having a passband that is a first frequency band, the first path connecting the antenna terminal and the first input/output terminal;
a second filter circuit disposed on a second path and having a passband that is a second frequency band higher than the first frequency band, the second path connecting the antenna terminal and the second input/output terminal; and
a first band-elimination filter circuit that is a part of the second filter and that has an attenuation band that is a partial band of a third frequency band belonging to an unlicensed band, the third frequency band being higher than the second frequency band.